A. Printed Circuits in Electronic Equipment to Provide the Following Functions:

1, To provide integrated circuits and other various electronic components fixed, assembly of mechanical support.

2, The realization of integrated circuits and other electronic components between the wiring and electrical connection or electrical insulation.

3, To provide the required electrical characteristics, such as characteristic impedance.

4, For automatic soldering to provide solder resist graphics, for component insertion, inspection and maintenance to provide identification characters and graphics.

B. Some Basic Terms Relating to Printed Circuit Boards are as Follows:

1, In the insulating substrate, according to a predetermined design, made of printed lines, printed components or a combination of both conductive graphics, known as printed circuits.

2, In the insulating substrate, to provide electrical connections between the elements, devices, conductive graphics, known as printed lines. It does not include printed elements.

3, Printed circuits or printed lines of the finished board is called a printed circuit board or printed circuit board, also known as printed board.

4, Printed circuit board in accordance with the substrate used is rigid or flexible can be divided into two categories: rigid printed circuit board and flexible printed circuit board. According to the number of layers of conductor graphics can be divided into single-sided, double-sided and multilayer printed circuit board.

5, The entire outer surface of the conductor graphics and the surface of the substrate is located in the same plane of the printed circuit board, known as the plane printed circuit board.

6, About the printed circuit board terms and definitions, see the national standard GB/T2036-94 “printed circuit terminology “.

7, Electronic equipment using printed circuit boards, due to the consistency of similar printed circuit boards, thus avoiding the error of manual wiring, and electronic components can be automatically inserted or mounted, automatic soldering, automatic testing, to ensure the quality of electronic equipment, improve labor productivity, reduce costs, and easy maintenance.

8, Printed circuit boards from single-layer development to double-sided, multi-layer and flexible, and still maintain their respective development trends. As a result of continuous development to high precision, high density and high reliability direction, and constantly reduce the size, reduce costs, improve performance, so that the printed board in the future development of electronic equipment in the project, still maintain a strong vitality.

9, High frequency board is a high electromagnetic frequency of special circuit boards, generally speaking, high frequency can be defined as the frequency of 1GHz or more. Its physical properties, precision, technical parameters require very high, commonly used in automotive collision avoidance systems, satellite systems, radio systems and other fields. Electronic equipment, high frequency is the development trend, especially in the wireless network, satellite communications, the growing development of information products to high-speed and high-frequency, and communications products to the capacity of fast wireless transmission of voice, video and data standardization, so the development of a new generation of products need high-frequency substrate.

C. The Sign of the Technical Level of the Printed Circuit Board:

Printed circuit board technology level mark for double-sided and multi-layer hole metalized printed circuit boards: both mass-produced double-sided metalized printed circuit boards, in 2.50 or 2.54mm standard grid intersection between the two pads, the number of wires can be laid as a sign.

Between the two pads to lay a wire for low-density printed circuit boards, the width of the wire is greater than 0.3mm. between the two pads to lay two wires for medium-density printed circuit boards, the width of the wire is about 0.2mm. between the two pads to lay three wires for high-density printed circuit boards, the width of the wire is about 0.1-0.15mm. between the two pads to lay four wires can be counted as ultra-high-density Printed board, the line width of 0.05-0.08mm.

After you have prepared all the processes, please use CAD, 99sE, or Gerber format to export and send to sales4@xcepcb.com To provide you with drawing information, we will evaluate, analyze, and provide you with a satisfactory quotation as soon as we receive your drawing requirements.

The following are all the processes before exporting PCB printing files.

Our company is 2-36 layers professional high frequency microwave printed circuit board supplier. Can double-sided 24 hours, multi-layer 48 hours delivery; fast sample and small and medium batch strength manufacturers. With more than ten years of strong production experience, skilled craftsmanship, engineering technology and quality service. With the advantages of high quality, low cost and foreign information technology support.

Long-term supply of high frequency PCB circuit boards, Rogers highfrequency boards, Taconic high frequency boards, F4B/Teflon high frequency boards, microwave RF boards, special circuit boards and so on. HF circuit boards, PCB high frequency boards, Rogers circuit boards, high frequency microwave RF boards, microwave induction circuit boards. Please send us an email near your demand at sales4@xcepcb.com. We will do our best to provide you with the most satisfactory service.