Products Description
4350B+FR4 Immersion Gold High Frequency PCB’s performance, application area and function?
The 4350B+FR4 Immersion Gold HF PCB is a hybrid circuit board that combines Rogers RO4350B HF material and FR-4 material, which is surface treated by an immersion gold process. This board combines the excellent electrical performance of RO4350B with the cost-effectiveness of FR-4 for a wide range of high-frequency applications. The following is an overview of its properties, application areas and functions:
Performance
Low Dielectric Loss: The RO4350B material has a dielectric loss factor (Df) of 0.0037 at 10 GHz, which helps to minimize losses in signal transmission.
Stable Dielectric Constant: The dielectric constant (Dk) is 3.48±0.05 and varies little with temperature, which helps to maintain the stability of circuit performance under different environmental conditions.
Low Coefficient of Thermal Expansion: RO4350B has a low Z-axis coefficient of thermal expansion, which helps improve the dimensional stability of multilayer circuit boards.
Excellent Dimensional Stability: Due to its low coefficient of thermal expansion and low in-board expansion coefficient, the 4350B+FR4 hybrid laminate exhibits excellent dimensional stability.
Ease of Mass Production: RO4350B material is processed similarly to FR-4, making it easy to produce in large quantities, and it can be used in multilayer hybrid presses with FR-4 materials, improving productivity and cost-effectiveness.
Fire Rating: Typically meets UL 94V-0 fire rating for active devices and high power RF designs.
Immersion Gold Finish: Provides good solderability and oxidation resistance, suitable for a variety of soldering processes.
Application Areas
Cellular Base Station Antennas and Power Amplifiers: Suitable for base station antenna and power amplifier design due to its low loss and stable electrical characteristics.
Microwave Point-to-point Connections (P2P): Suitable for point-to-point connection devices in microwave communication systems.
Automotive Radar and Sensors: In automotive radar systems, the 4350B+FR4 hybrid voltage board provides stable performance and low-loss signal transmission.
Radio Frequency Identification (RFID) Tags: Suitable for the design of tags and readers in RFID systems.
LNB for Live Satellite: Suitable for low noise block downconverters in live satellite systems.
ETC System Control Board: Suitable for the design of control boards in electronic toll collection systems.
Millimeter-wave Radar Antenna: In millimeter-wave radar systems at 24GHz, 77GHz or 79GHz, the 4350B+FR4 mixed-pressure board can provide a high-performance PCB antenna solution.
Role
The main role of the 4350B+FR4 immersion gold HF PCB is to provide a cost-effective, high performance board solution for high frequency and microwave applications. It ensures low loss and high stability of signals during transmission, while simplifying the production process and reducing manufacturing costs. This type of mixed platen plays an important role in modern communications, automotive electronics, aerospace and military applications.
Precautions for processing 4350B+FR4 Immersion Gold HF PCB?
The following are some important considerations when processing 4350B+FR4 Immersion Gold HF PCBs:
Material Selection: Ensure the use of high quality RO4350B and FR4 materials, which should have good HF electrical characteristics and stable dielectric properties.
Drilling: As RO4350B material is relatively fragile, special attention should be paid to the selection of drill bits and the setting of drilling parameters during the drilling process to avoid sheet breakage.
Hole Metallization (PTH Copper Immersion): The hole wall of RO4350B material is not easy to be coppered, and special hole treatment techniques, such as plasma treatment or sodium naphthalene activation treatment, may be required.
Pattern Transfer: Precise control of line width and line spacing to ensure signal integrity and minimize transmission loss.
Etching: Controls the creation of line nicks and sand holes, defects that can affect circuit performance.
Soldermask Fabrication: Control soldermask adhesion and blistering, which may require the use of appropriate pre-treatment methods and strict control of the curing process.
Surface Treatment: Strictly control scratches and damages on the board surface, as these defects will affect the performance and reliability of the circuit.
Precision Control: HF boards require high precision, including impedance control, line alignment, etc., all of which place higher demands on the processing technology.
Testing and Inspection: The testing and inspection of high-frequency boards is more complex, requiring the use of specialized equipment and technology to ensure that the performance of the circuit to meet the design requirements.
Cleanliness: Improve PCB cleanliness, reduce residue and solder buildup, and avoid the risk of corrosion and contamination caused by ionic residue.
Tolerance Control: Strictly control the tolerances of shapes, holes and other mechanical features to improve the dimensional quality of products.
No Soldering Repair: Avoid soldering repair or broken wire repair to ensure product reliability.
Soldermask Material Selection: Select excellent inks to ensure that the soldermask ink meets UL standards.
Service Life Control: Strictly control the service life of each surface treatment to reduce the risk of moisture intrusion.
End-of-life Unit Handling: Do not accept sets of boards with end-of-life units to avoid assembling known bad boards and wasting parts and time.
Environmental Compliance: Ensure all materials and processes meet environmental requirements such as UL 94V-0 fire rating.
Thermal Management: For applications requiring high heat dissipation, consider embedded copper blocks or other thermal solutions.
Supply Chain Management: Ensure supply chain stability to avoid production disruptions due to material shortages.
By following these considerations, you can ensure that the 4350B+FR4 immersion gold HF PCBs are processed with the quality and performance to meet the stringent requirements of HF applications.
