Products Description
The 6-layer HDI PCB (High Density Interconnect Printed Circuit Board) is a multilayer circuit board that realizes a high degree of integration of electronic components in a smaller space by using finer lines and spaces, blind and buried hole technology. The following is an overview of 6-layer HDI PCB characteristics, application areas and processing requirements:
6-layer HDI PCB Features:
High Density Lines and Space: 6-layer HDI PCBs enable fine lines and smaller apertures for more circuits on a smaller board surface.
Blind and Buried Vias Technology: Blind vias (vias that do not penetrate the PCB) and buried vias (vias that are completely inside the PCB) are used to increase the density of interconnections between layers.
Multi-layer Construction: 6-layer construction provides more space for power and ground layers, helping to improve power management and reduce noise.
Impedance Control: Through precise layer design and material selection, 6-layer HDI PCBs provide better impedance control for high-speed signaling.
Miniaturized Design: Suitable for applications that require miniaturized and thin designs, such as smartphones, wearable devices, etc.
High-performance Materials: Materials with low dielectric constant (Dk) and low loss factor (Df) are often chosen to increase signal transmission speed and reduce loss.
6-layer HDI PCB Application areas:
Consumer Electronics: Such as smart phones, tablet PCs, HDTVs, etc.
Computer and Network Equipment: Such as servers, routers, switches, etc.
Automotive Electronics: Such as navigation systems, in-vehicle infotainment systems, etc.
Medical Equipment: Such as portable monitoring equipment, minimally invasive surgical instruments.
Industrial Control: e.g. automation control systems, robotics, etc.
Communication Equipment: e.g. 5G base stations, communication routers, etc.
6-layer HDI PCB Processing Requirements:
Precision Design and Layout: Optimization of component layout needs to be considered during design to reduce signal transmission delay and cross-interference.
Material Selection: Select high-performance substrate materials and copper foils of appropriate thickness to meet the requirements of conductivity and fine line production.
Precision Drilling Technology: Use of laser drilling or mechanical drilling combined with plating to fill holes, requiring extremely high positioning accuracy and hole wall smoothness.
Fine Line Fabrication and Surface Treatment: Advanced exposure developing and etching technologies are used to ensure the accuracy of line width and spacing, and appropriate surface treatment is applied to provide good solderability and corrosion resistance.
Strict Quality Control and Testing: Strict quality control measures are implemented, including automatic optical inspection (AOI), X-ray inspection (AXI), and in-circuit testing (ICT) to ensure that each PCB meets design requirements and industry standards.
The production and processing of 6-layer HDI PCBs is a highly specialized and technology-intensive task, and every step of the process needs to be precisely controlled and rigorously guarded to ensure the high performance and reliability of the final product.
Our company is a professional enterprise specializing in high frequency microwave RF induction printed circuit board fast sample and small and medium-sized mass production. Year-round stock of domestic and imported high-frequency boards, such as Rogers, Taconic, Isola , F4B (Teflon), TP-2, FR4, etc., with dielectric constants ranging from 2.2 to 10.6.
