Products Description
FR4(KB6160) High Frequency PCB
(Kingboard Laminates Holdings Limited) An FR-4 standard copper-clad epoxy glass fiber cloth laminate. This material exhibits a number of specific properties and characteristics in HF PCB applications and some of its key information is provided below:
FR4 (KB6160) HF PCB Performance Characteristics:
Dielectric Properties: KB6160 has a dielectric constant (Dk) of 4.58 at 1MHz and a dielectric loss (Df) of 0.022 at 1MHz. These properties are very important for high frequency signal transmission as they affect signal delay and loss.
Thermal Properties: The glass transition temperature (Tg) reaches 135°C, providing good heat resistance for a wide range of electronic devices.
Mechanical Properties: Flexural strength of 565 N/mm² and copper foil peel strength of 1.70 N/mm at 125°C show good mechanical strength.
Thermal Resistance: Thermal stress test shows that the material has a thermal stress test value of >180 seconds at 288°C for 10 seconds, indicating its stability in high temperature environments.
Flame Retardant Properties: Complies with UL94 V-0 flame retardant rating for applications requiring high flame retardant properties.
Dimensional Stability: Z-axis coefficient of thermal expansion of 58/286 ppm/°C provides good dimensional stability.
Moisture Resistance: Low water absorption of less than 0.19% helps maintain performance in humid environments.
Arc Resistance: Arc resistance test results of 125 seconds indicate that the material has good arc resistance.
FR4 (KB6160) High frequency PCB application areas:
KB6160 material is suitable for the following areas:
Computers and peripherals
Communication equipment
Instrumentation
Office automation equipment, etc.
FR4(KB6160) Precautions for HF PCB processing:
Drilling: Use appropriate drill bits and drilling parameters to avoid damage during drilling.
Hole Metallization: Special hole treatment techniques may be required, such as plasma treatment or sodium naphthalene activation treatment.
Pattern Transfer: Precise control of line width and line spacing to ensure signal integrity and minimize transmission loss.
Soldermask Fabrication: Control of soldermask adhesion and blistering may require the use of appropriate pre-treatment methods and strict control of the curing process.
Surface Treatment: Strictly control scratches and damages on the board surface, as these defects will affect the performance and reliability of the circuit.
Testing and Inspection: Testing and inspection of HF boards is more complex and requires the use of specialized equipment and techniques to ensure that the performance of the circuit meets the design requirements.
Storage Conditions: The material should be stored at a humidity of less than 50% and a temperature of less than 23°C to maintain its performance.
As an FR-4 material, KB6160 provides a good balance of performance in high-frequency PCB applications, and is particularly suitable for applications that are cost-sensitive but also require a certain level of electrical performance.
