Products Description
RO4350B is a high-frequency PCB material manufactured by Rogers that offers a range of excellent properties that make it ideal for high-frequency applications. Below is a detailed description of the properties, application areas and processing requirements for RO4350B 4-layer HF PCBs:
RO4350B 4-Layer High Frequency PCB Characteristics:
Dielectric Constant (Dk): 3.48 +/- 0.05, which means it can provide stable electrical performance over a wide frequency range.
Loss Factor (Df): 0.0037 @ 10GHz, the low loss characteristics help minimize losses in signal transmission.
Z-axis Coefficient of Thermal Expansion (CTE): 32 ppm/°C. The low CTE contributes to the product’s dimensional stability.
Flame Retardant: UL 94 V-0 rated for active devices and high power RF designs.
Processing: Similar to standard epoxy/glass (FR-4), easy to produce in high volume without special through-hole treatments or handling procedures.
Cost-effective: RO4350B offers a more cost-effective solution compared to PTFE materials.
RO4350B 4-layer HF PCB Application Areas:
Radio Backhaul: For radio signal transmission and reception.
Communication Systems: Including cellular network base stations, satellite communications, etc.
High-speed Computing: RF circuits used in high-performance computing devices.
IP Infrastructure: Used for RF modules in network equipment.
Power Amplifiers: Used for signal amplification in wireless communications.
Small Base Station/Distributed Antenna System (DAS): Used in small base stations to provide wireless coverage.
Test and Measurement: Used in RF test and measurement equipment.
Automotive Radar and Sensors: For radar sensors in automotive safety systems.
Radio Frequency Identification (RFID) Tags: For wireless identification and tracking tags.
RO4350B 4-layer HF PCB processing requirements:
Drilling: Precise control of the drilling process is required to avoid damage to the board.
Lamination Process: Precise control of temperature, pressure and time is required to ensure good adhesion between layers.
Surface Treatment: Common surface treatments include gold immersion, gold plating, etc. to improve soldering performance and oxidation resistance.
Impedance Control: The impedance of the line needs to be precisely controlled to ensure stable signal transmission.
Layer Structure: Reasonable layer structure helps to control impedance and reduce signal crosstalk.
Layout and Wiring: Layout and wiring should minimize signal path length and crossover to reduce signal distortion and crosstalk.
Ground Plane Design: Good ground plane design helps to absorb signal return and reduce signal reflection and interference.
Environmental Control: Processing is carried out in a constant temperature and humidity environment to minimize the impact of environmental factors on board performance.
Quality Testing: Strict quality testing is required, including impedance testing and thermal performance testing.
These characteristics of RO4350B make it an ideal material for high frequency PCB design and manufacturing, especially in applications requiring high performance and reliability.
