Products Description
RO4350B is a high-frequency circuit board material produced by Rogers. It has excellent electrical properties, especially low insertion loss and stable dielectric properties in high-frequency applications. When combined with the immersion gold process, this material can perform even better in high frequency circuit boards. The following is an overview of the properties, applications, and considerations for RO4350B HF circuit boards in combination with the immersion gold process:
Performance of RO4350B High Frequency Circuit Board
Low Dielectric Loss: RO4350B has a dielectric loss factor (Df) of 0.0037 at 10 GHz, which helps to minimize losses in high frequency signal transmission.
Stable Dielectric Constant: The dielectric constant (Dk) is 3.48±0.05 and varies less at different frequencies, which helps maintain stable circuit performance.
Low Coefficient of Thermal Expansion: The Z-axis coefficient of thermal expansion is 32 ppm/°C, which helps improve the dimensional stability of multilayer circuit boards.
High Glass Transition Temperature (Tg): RO4350B has a Tg value greater than 280°C, providing good heat resistance.
Immersion Gold Finish: The immersion gold process provides a thicker gold layer with excellent solderability and oxidation resistance for a variety of soldering processes.
Application Fields of RO4350B High Frequency Circuit Board
Microwave Communications: Such as base station antennas, power amplifiers, etc.
Automotive Electronics: Including automotive radar systems and sensors.
Aerospace: In the aerospace field, this PCB can be used for high-performance communication and navigation systems.
Military and Defense: In military communications and electronic warfare systems, the high performance and reliability of this PCB is critical.
Radio Frequency Identification (RFID) Tags: For the design of tags and readers in RFID systems.
Processing Precautions of RO4350B High Frequency Circuit Board
Drilling: Special attention should be paid to the selection of drill bits and the setting of drilling parameters during the drilling process to avoid board breakage.
Hole Metallization: Special hole treatment techniques may be required, such as plasma treatment or sodium naphthalene activation treatment.
Soldermask Production: Control of soldermask adhesion and blistering may require the use of appropriate pre-treatment methods and strict control of the curing process.
Surface Treatment: Strictly control scratches and damages on the board surface, as these defects will affect the performance and reliability of the circuit.
Testing and Inspection: Testing and inspection of HF boards is more complex and requires the use of specialized equipment and techniques to ensure that the performance of the circuit meets the design requirements.
Storage Conditions: Materials should be stored at less than 50% humidity and less than 23°C to maintain their performance.
Environmental Compliance: Ensure that all materials and processes meet environmental requirements such as UL 94V-0 fire rating.
