Products Description
Rogers 4003 Double Sided Antenna Circuit Board Properties and Functions
Rogers 4003 Double Sided Antenna Circuit Board is a high performance HF circuit material that combines excellent electrical properties with a cost effective manufacturing process. Here are some of its key properties and functions:
Low Dielectric Loss and Stable Dielectric Constant: Rogers 4003 circuit boards have a low dielectric loss (Df: 0.0027 @10 GHz) and stable dielectric constant (Dk: 3.38±0.05 @10 GHz), which makes it excellent for high-frequency applications, especially in the frequency range above 500 MHz.
Excellent Dimensional Stability: With a coefficient of thermal expansion (CTE) similar to that of copper, 4003 circuit boards exhibit excellent dimensional stability, which is critical for multilayer circuit board construction.
High Glass Transition Temperature (Tg): The Tg value of 4003 circuit boards is greater than 280°C, which means it maintains dimensional stability throughout the circuit board processing.
Compatible with Standard FR-4 Processing: 4003 circuit boards can be processed like standard FR-4 material without the need for special through-hole pre-treatment processes such as sodium etching, which reduces manufacturing costs.
Double-sided Board Suitability: The double-sided board design allows for more complex circuit layouts for high-frequency applications that require double-sided alignments.
Broadband Applications: Due to its low dielectric loss and stable dielectric constant, 4003 circuit boards are ideally suited for broadband applications such as microstrip line designs, cellular base station antennas, and more.
Environmental Stability: The low fluctuation of the 4003 circuit board’s dielectric constant with temperature allows it to maintain stable performance under varying environmental conditions.
Cost Effective: Compared to traditional microwave laminates, 4003 circuit boards offer a more cost effective alternative while maintaining high performance.
Wide Range of Applications: 4003 circuit boards are suitable for a wide range of high-frequency applications, including wireless communications, automotive radar systems, radio frequency identification (RFID) technology, microwave communications and power amplifiers.
Environmentally Compliant: For applications requiring UL 94V-0 flame retardant ratings, Rogers offers alternative materials such as RO4350B to meet specific safety specifications.
Rogers 4003 double-sided antenna circuit boards are widely used in high-frequency circuit design due to their superior electrical performance, stable dielectric properties, excellent dimensional stability, and cost-effectiveness.
Considerations for Processing Rogers 4003 Double Sided Antenna Circuit Board
When processing Rogers 4003 double-sided antenna circuit boards, the following considerations need to be taken into account to ensure the performance and quality of the boards:
Storage Conditions: Rogers 4003 circuit boards should be stored at room temperature. A “first in, first out” inventory system is recommended, and the lot number of the board should be recorded.
Inside Processing: Includes locating hole compatibility, graphic transfer pre-treatment, graphic transfer, DES etching and oxidization. Chemical cleaning or mechanical abrasive brushing treatments are selected based on the thickness of the sheet.
Press-fit: Recommended pre-bake temperature is 125°C – 150°C. Bonding sheets for multilayer boards should be compatible with RO4400™ bonding sheets, and press-fit conditions should match the parameters required for the bonding sheets.
Drilling: Use standard cover/gasket materials with controlled drop, drill and retract speeds. Drilling conditions should be adjusted to the chip removal capacity of the drill and the thickness of the sheet.
Deburring: Abrasive deburring can be done mechanically, for thick core/multilayer boards.
Pre-treatment of Holes: Chemical deburring or plasma deburring can be used, but etching back process is not recommended.
Metallized Holes: Electroless chemical copper deposition or direct metal deposition process can be used.
Final Surface Finish: Should be compatible with most metal finishes and organic soldermask surface finishes (OSP). Additional baking of the sheet is done before printing with drought resistant inks.
Profile Finishing: Milling, punching, or V-grooving processes can be used. Diamond cutters or carbide tipped multi-flute spiral milling cutters are recommended. v-groove depth should be controlled to be less than 1/2 the thickness of the sheet.
Prolonged Exposure to Oxidizing Environments: May cause changes in the dielectric electrical properties of hydrocarbon materials and should be evaluated for suitability for each material and design option.
Solder Resist: Liquid photoimageable solder resist and epoxy screen print resist are recommended for best adhesion.
Hot Air Leveling: Baking conditions are similar to epoxy fiberglass (FR4) boards, but be aware that RO4003 boards may burn at high temperatures, so precautions need to be taken.
Engineering Design: The correct process compensation should be made to the original negative according to the change of line width, etching coefficient, copper thickness of the line, and the customer’s requirement of line width after the enterprise’s optical imaging.
Milling Profile: Attention should be paid to the maximum stack height, which should be 70% of the actual milling cutter chipformer slot length in order to exclude dust.
Environmental Compliance: RO4350B™ substrates are recommended for applications that require a UL 94V-0 flame retardant rating.
The above precautions cover all aspects of the process from storage, to processing, to final handling, ensuring the quality and performance of the Rogers 4003 double-sided antenna circuit boards.
