Products Description
The performance characteristics of the 4-layer Rogers 5880 immersion gold RF PCB mainly include the following points:
Material Properties: Rogers RT/duroid 5880 material is used, which is a polytetrafluoroethylene glass fiber reinforced material.
Dielectric Constant: At an operating frequency of 10GHz, the dielectric constant (Dk) is 2.20±0.02, which is significantly lower than similar materials on the market and is very important for high-frequency design applications.
Dielectric Loss: The dielectric loss factor (Df) is measured at 0.0009 at 10GHz. The extremely low dielectric loss helps minimize dispersion and loss, and is suitable for high-frequency and wide-band designs.
Moisture Absorption Rate: The extremely low moisture absorption rate of only 0.02% makes this material very suitable for applications in high humidity environments.
Processing Performance: The material is easy to cut into the desired shape and can resist the erosion of solutions and reagents used in etching and through-hole plating.
Resistance: It has good resistance to solutions and reagents used in etching or plating edges and through-hole processes.
Application Areas: Suitable for point-to-point digital radio antennas, microstrip and stripline circuits, millimeter wave applications, missile guidance systems, military radar systems, high-frequency circuit boards for commercial aviation telephones, etc.
Processing Technology: The processing technology is similar to FR-4, but the cost is lower, providing high cost performance and excellent dimensional stability.
Environmental Protection Standards: Meet the lead-free process standards and are suitable for applications with strict environmental protection requirements.
Minimized Design Specifications: Minimum drilling 0.3mm, minimum line width 0.35mm, minimum line spacing 0.2mm, these specifications help to achieve high-density circuit design.
High Frequency Support: Can support applications up to Ku band or even higher frequencies, suitable for the needs of modern high-frequency communication technology.
Good Electrical Performance: Maintain consistent electrical characteristics over a wide frequency range to ensure the stability and reliability of signal transmission.
Dimensional Stability: Due to the isotropy of the material, its electrical properties change very little with frequency, ensuring the performance consistency of the circuit board at different frequencies.
Heat Resistance: Rogers 5880 material has good heat resistance and is suitable for use in higher temperature environments.
Chemical Resistance: The material is able to resist chemical agents used in the production process, such as etchants and plating solutions.
Mechanical Strength: Due to the reinforcement of glass fiber, the material has high mechanical strength and is suitable for use in applications that need to withstand certain mechanical stress.
Easy Processing: The material is easy to cut, drill and other processing operations, which facilitates the realization of complex circuit board designs.
Environmental Stability: The material is less sensitive to environmental changes (such as temperature and humidity), ensuring reliability under different environmental conditions.
Electromagnetic Compatibility: Due to low dielectric constant and low dielectric loss, it helps to improve the electromagnetic compatibility of the circuit.
Long-term Reliability: The long-term stability and durability of the material ensure the reliability of the circuit board in long-term use.
When producing 4-layer Rogers 5880 immersion gold RF PCB, you need to pay attention to the following issues to ensure product quality and performance:
Material Selection: Ensure the use of genuine Rogers 5880 materials and avoid using counterfeit or inferior materials.
Sheet Thickness Consistency: Maintain the consistency of sheet thickness to avoid dimensional deviation during processing.
Drilling Accuracy: Precisely control the drilling size and position to meet the minimized design specifications.
Interlayer Alignment: Ensure accurate alignment between layers to avoid interlayer misalignment affecting circuit performance.
Immersion Gold Process: Use high-quality immersion gold process to ensure uniformity and adhesion of gold layer.
Etching Control: Precisely control etching process to avoid over-etching or under-etching.
Impedance Control: Strictly control impedance to ensure impedance continuity and matching in circuit design.
Thermal Management: Pay attention to thermal management during production to avoid changes in material properties due to excessive temperature.
Environmental Control: Keep the production environment clean and stable to avoid the impact of dust and humidity on products.
Quality Inspection: Perform quality inspection regularly to ensure that each circuit board meets design and performance requirements.
Electromagnetic Compatibility Test: Perform electromagnetic compatibility test on finished products to ensure compatibility of products in actual applications.
Stress Test: Perform stress test to evaluate the reliability of circuit boards under mechanical stress.
Batch Mmanagement: Strict batch management to ensure consistency and traceability of each batch of products.
Operator Training: Professional training for operators to ensure that they are familiar with production processes and quality standards.
Equipment Maintenance: Maintain and calibrate production equipment regularly to ensure the accuracy and stability of the equipment.
Design Rule Check: Perform design rule check (DRC) before production to ensure that the design meets production requirements.
Process Documentation: Maintain detailed records of the production process to facilitate problem tracking and continuous improvement.
