1, The inner layer;Mainly for the production of PCB circuit boards, the inner layer of the line;
The production process is:
1) Cutting:Cut the PCB substrate to production size;
2) Pre-treatment:Clean the surface of the PCBsubstrate, to remove surface contaminants;
3) Pressure Film:The dry film on the surface of the PCB substrate, in preparation for the subsequent image transfer;
4) Exposure:Use exposure equipment to expose the laminated substrate using UV light, thus transferring the image of the substrate to the dry film;
5) DE:Will be exposed after the substrate through the development, etching, film, and then complete the production of the inner layer of the board.
2, Internal Inspection: Mainly for the detection and repair of board lines;
3, AOI: AOI optical scanning, can be the image of the PCB board and has been entered into the good board data for comparison, in order to find the board image above the gap, depression and other undesirable phenomena;
4, VRS: After the AOI detected defective image data transmitted to the VRS, by the relevant personnel for overhaul;
5, Fill Line: The gold wire soldered in the gap or depression, in order to prevent the electrical bad;
6, Press-fit: Is to press several inner laminates into one board;
7, Browning: Browning can increase the adhesion between the board and the resin, as well as increase the wettability of the copper surface;
8, Riveting: Cut the PP into small sheets and normal size so that the inner layer of the board and the corresponding PP;
9, MouJin: Stacking and pressing, hitting the target, gong edges, and grinding edges;
10, Drilling: In accordance with customer requirements using a drilling machine will be drilled out of the board with different diameters, different sizes of holes, so that the board through the holes in order to follow up on the processing of plug-ins, but also to help the board heat dissipation;
11, A Copper: For the outer layer of the board has been drilled holes in copper plating, so that the board’s various layers of line conduction;
12, Deburring Line: To remove the board’s hole side of the burr, to prevent the emergence of copper plating bad;
13, In Addition to The Glue Line: To remove the hole inside the glue residue; so as to increase the adhesion in the micro-etching;
14, The Outer Layer: The outer layer with the first step of the inner layer of the process is more or less the same, its purpose is to facilitate the subsequent process to make the line;
15, Secondary Copper and Etching: Secondary copper plating, etching;
16, Solder Resist: Can protect the board to prevent oxidation and other phenomena;
17, Text: Printed text;
18, Acid Wash: Clean the surface of the board, remove surface oxidation to strengthen the adhesion of the printing ink;
19, Processing OSP: The side of the bare copper board to be soldered by the coating treatment, the formation of a layer of organic skin film to prevent rust oxidation;
20, Molding: Gong out of the board shape required by the customer, to facilitate customer SMT mounting and assembly;
21, Flying Pin Test: Test the board circuit to avoid short circuit board outflow;
22, FQC: Final inspection, complete all the processes after sampling full inspection;
23, Packaging, out of the warehouse, to complete the delivery.
PCB Manufacturing Process Under the Material Flow
A. Open Material:
Open material is a process in the production of PCB to punch a variety of sheet metal process.
The original copper-clad board cut into the required size is its most important requirement, generally has two processing platforms, production and processing of a platform processing is completed automatically converted to the next processing platform, will be sent to the production line to the next process, the choice of openers must require precision, in the process of rapid cutting, to maintain high-precision cutting quality. There is also a convenient and simple interactive interface, so that any worker can be trained to quickly get started, reducing the cost of labor in the enterprise, there is also the requirement to meet the advantages of recognizing a variety of documents.
B. Grinding Plate:
Grinding plate is actually the use of liquid and water mixed with mechanical equipment in the copper-clad plate grinding, grinding machine to adjust the appropriate parameters (temperature, speed, etc.) and the need to wait for the mechanical warming, grinding plate can only wait for the mechanical temperature is higher than 80C ° to grind the plate, lower than 80C ° will appear grinding plate is not clean. Remove the oxidized surface, increase the roughness of the copper surface, if there is dust, it may lead to the final circuit short-circuit or broken.
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PCB Circuit Board Cutting Methods
In the PCB manufacturing process, usually use some way to cut, PCB circuit boards have a variety of cutting methods:
A. Straight Cutting (V-cut):This is the most common type of cutting. By using a cutting tool or V-knife, straight cuts are made along the edge of the PCB board or a specified cut line to achieve the desired size and shape.
B. Milling Cutting:For PCB boards requiring more precise shapes and hole locations, milling cuts are often performed using a CNC milling machine. Based on the design documents, excess material is removed from the PCB using a rotary tool to achieve the desired shape and size.
C. Wire Cutting:Some complex PCB boards may require internal or complex curves to be cut. This can be done by using wire cutting technology, which cuts the PCB along a predetermined path by means of a high-speed fine wire cutter. Wire cutting can achieve a high degree of precision and complexity.
D. Laser Cutting:Laser cutting is a non-contact cutting technology that enables high precision and complex shapes to be cut. Through the heat of the laser beam, the material on the PCB board is vaporized or melted to achieve the desired shape cut.
