Production equipment for high-frequency and RF PCB manufacturing.
The main production floor, where panels move through each fabrication step.
Cuts laminate sheets into production panel sizes according to work instructions.
Transfers the circuit pattern onto the panel by photo-imaging.
Etches away unwanted copper to form the finished circuit pattern.
Automatic optical inspection checks circuit patterns against the design data.
Brown oxide treatment improves adhesion between prepreg and inner-layer copper.
Bonds inner layers and prepreg into multilayer panels under heat and pressure.
Electroless copper deposition makes drilled through-holes conductive.
Electroplating builds copper in holes and on traces to the required thickness.
CNC drilling creates holes for vias, PTH and component mounting.
CNC routing separates panels into individual boards to the requested outline.
Flying needle testing verifies continuity and isolation of finished boards.