
High-Frequency Antenna PCB
Layers: 4
Board Material: F4B M220
Board Thickness: 1.2 mm
Surface Technology: Immersion Gold
Copper Thickness: 1oz
Soldermask Color: Green

Layers: 4
Board Material: F4B M220
Board Thickness: 1.2 mm
Surface Technology: Immersion Gold
Copper Thickness: 1oz
Soldermask Color: Green

Layer: 2
Board Material: Taconic
Board thickness: 1.1mm
Surface Technology: Immersion Gold
Copper thickness: 0.5oz
No Solder Resist

Number of layers: 4
Board Material: F4B M225
Board Thickness: 1.0 mm
Surface Technology Immersion Gold
Holes Resin Plug Holes
Soldermask Color: Brown
No Characters

Layers: Double-sided Board
Size: 32.1*76.6mm
Board Material: RO4003C
Board Thickness: 0.813mm
Copper Thickness: 1oz
No Solder Resist, No Character
Surface Process: OSP
Minimum Line Spacing: 4mil
Minimum Drilling: No Drilling

Layers: 4
Finished Board Thickness: 1.6mm
Size: 213*45mm
Veneer Delivery
Process Requirement: Immersion Gold
Finished Copper Thickness: 1oz
Plate Material: FR4 TG170
Green Oil with White Characters
With Gold Fingers

Layers: 4
Finished Board Thickness: 2.7mm
Size: 212*172mm
Process Requirements: Immersion Gold
Finished Copper Thickness: 1oz
Board material: Rogers 4350B
Green Oil With White Lettering