The typical thickness range for Rogers RO3003 high-frequency circuit boards is 0.1 mm to 6 mm, and the specific thickness can be selected based on application requirements. Below are the detailed specifications and thickness-related information:
I. Core Specifications
Dielectric Constant (Dk)
Nominal Value: 3.00 (±0.04)
Frequency Stability: Within the range of 10 GHz to 77 GHz, the dielectric constant varies minimally (e.g., 3.07 at 77 GHz), ensuring stable high-frequency signal transmission.
Dielectric Loss (Df)
Typical Value: 0.0010 (at 10 GHz)
Advantage: An extremely low loss factor significantly reduces energy loss during signal transmission and improves system efficiency, making it particularly suitable for applications such as high-power amplifiers and filters.
Coefficient of Thermal Expansion (CTE)
X-axis: 17 ppm/°C
Y-axis: 16 ppm/°C
Z-axis: 25 ppm/°C
Significance: A low CTE ensures high dimensional stability of the material under temperature changes, reducing circuit deformation or reliability issues caused by thermal expansion and contraction.
Other Parameters
Flame Retardant Rating: V-0 (meets strict safety standards)
Thermal Conductivity: 0.5 W/m·K (moderate thermal conductivity, meeting general heat dissipation requirements)
Density: 2.1 g/cm³ (lightweight design, suitable for weight-sensitive applications)
II. Thickness Selection and Application Scenarios
Thin Boards (0.1 mm – 0.5 mm)
Applications: High-frequency flexible circuits, micro-antennas, wearable devices, and other scenarios with extremely tight space constraints.
Advantages: The thin, lightweight design reduces signal transmission paths and minimizes loss, while facilitating integration into compact devices.
Standard Plates (0.5 mm – 2 mm)
Applications: Automotive radar (e.g., 77 GHz millimeter-wave radar), 5G base station antennas, RF couplers, etc.
Advantages: Balances mechanical strength with high-frequency performance, meeting the needs of most commercial microwave and RF applications.
Thick Boards (2mm – 6mm)
Applications: High-power RF modules, aerospace and defense sectors, and structures requiring additional mechanical support or heat dissipation.
Advantages: Enhanced mechanical stability and improved heat dissipation efficiency, suitable for extreme environments or high-load scenarios.
III. Factors to Consider When Selecting Board Thickness
Impedance Control: Thickness directly affects the impedance of transmission lines (e.g., 50-ohm microstrip lines) and must be selected precisely according to design requirements.
Mechanical Strength: Thicker boards provide greater rigidity, making them suitable for applications subject to mechanical stress or vibration.
Thermal Management Requirements: Thicker boards increase thermal capacity and improve heat dissipation efficiency, making them suitable for high-power scenarios.
Multilayer PCB Design: In multilayer PCBs, different layers may use varying thicknesses to optimize performance and cost.
IV. Typical Application Cases
Automotive Radar: The RO3003’s stable dielectric constant and low-loss characteristics make it the material of choice for 77GHz automotive radar, supporting functions such as adaptive cruise control and collision warning.
5G Communications: Used in antennas and base stations for the millimeter-wave band, ensuring reliability and low latency for high-speed data transmission.
Aerospace and Defense: In satellite communications and radar systems, its stability in extreme environments (such as low water absorption and high TD values) ensures long-term reliability.