F4BM220 is a material specifically designed for high-frequency microwave and RF circuit boards, belonging to the polytetrafluoroethylene (PTFE) glass-fiber-reinforced copper-clad laminate series. Its key characteristics and applications are as follows:

I. Key Parameters

Electrical Properties

Dielectric constant (Dk): 2.20 ± 0.04 (at 10 GHz), ensuring stable signal transmission.

Dielectric loss tangent (Df): 0.001 (at 10 GHz); its low-loss characteristics make it suitable for high-frequency applications.

Thermal expansion coefficient (TcDk): -142 ppm/°C; performance remains stable under temperature fluctuations.

Physical Properties

Material Composition: A composite of PTFE (polytetrafluoroethylene) and glass fiber cloth, laminated with ED copper foil.

Thickness Range: Available from 0.1 mm to 12 mm; standard thicknesses include 0.254 mm, 0.508 mm, and 1.0 mm; customization supported.

Dimensions: Standard sizes include 460 × 610 mm and 914 × 1220 mm; maximum supported size is 1500 × 1000 mm; custom sizes available.

Mechanical Properties

Peel Strength: ≥18 N/cm at room temperature; maintains integrity without bubbling or delamination when immersed in molten solder at 260°C for 20 seconds.

Warpage: ≤0.03 mm/mm for 0.25 mm thickness, ensuring processing accuracy.

Environmental Adaptability

Operating Temperature: -50°C to +260°C, withstanding extreme temperatures.

Water Absorption: ≤0.02% (after 24-hour immersion in distilled water at 20°C), excellent moisture resistance.

II. Product Advantages

Excellent High-Frequency Performance: Low dielectric constant and loss factor, suitable for high-frequency applications such as 5G base stations and satellite communications.

Diverse Dimensions: Supports a wide range of thicknesses and sizes, reducing customer costs.

Commercial Mass Production: Cost-effective, suitable for large-scale applications.

Chemical Resistance: PTFE material resists strong acids and alkalis, extending service life.

III. Application Areas

Communication Equipment: 5G base station antennas, phase shifters, power dividers, couplers, and combiners.

Radar Systems: Phased array antennas, feed networks.

Industrial Control: Data communication, wireless communication base stations, automotive electronics, medical and industrial control.

Aerospace: Satellite communications, high-frequency components for military applications.

IV. Manufacturers and Customization Services

Major Manufacturer: Shenzhen Xincheng’er Electronics Co., Ltd.

Customization Capabilities: Supports customization of thickness, dimensions, copper thickness (0.5–5.0 oz), and solder mask color (green/red/blue/white/purple/black).

Production Lead Time: Prototyping: 3–4 days; Mass Production: 6–7 days; Expedited service available (24–72 hours).

V. Technical Documentation and Support

Specifications: The manufacturer provides detailed specifications, including electrical, physical, and mechanical performance test data.

Technical Support: Contact the manufacturer for DFM reviews, design optimization recommendations, and manufacturing parameter guidance.