Shenzhen Xinchenger Electronics Co., Ltd. is a strong manufacturer mainly engaged in fast sampling and small to medium-sized batch production of 2-36 layer high-frequency microwave RF induction printed circuit board. Professional production of high frequency, high-precision, high-density environmentally friendly PCB/PCBA board. The main products include: high frequency PCB/PCBA board, Rogers high frequency board, Taconic high frequency board, F4B/Teflon PCB high frequency, microwave RF board, special circuit board, etc. We have rich production experience in high frequency board used in industries such as data communication, wireless communication base stations, radar systems, automotive, medical, and military industries.
Minimum Line Width : 3MIL ;
Minimum Line Spacing : 3MIL ;
Drilling Diameter : ≥ 0.1mm ;
Processing Size : 600 * 1200mm;
Plate Thickness : 0.1-10mm ;
Processing Layers : 2-36 layers;
Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.
Minimum Line Width : 3MIL ;
Minimum Line Spacing : 3MIL ;
Drilling Diameter : ≥ 0.1mm ;
Processing Size : 600 * 1200mm;
Plate Thickness : 0.1-10mm ;
Processing Layers : 2-36 layers;
Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.
15 Years+ High Quality, High Performance, High Frequency PCB and PCBA. One-stop Strength Factory
15 Years of experience in high-frequency PCB manufacturing ensures product excellence.
Flexibly addressing customer needs byoffering a diverse range of branded substrates.
Strict quality control with advanced equipment guarantees stable andreliable products.
Efficient production ensures on-time delivery, shortens development cycles and increases competitiveness.
Learn why high frequency PCB prototyping is critical before mass production. Discover how RF PCB prototyping helps verify design performance, reduce manufacturing defects, optimize costs,
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